Dynamic Smart Cooling
HP created Dynamic Smart Cooling [US/Engl.] to enable equipment to interact with the facilities that support the data center, driving maximum efficiency. It bridges the gap between IT and facilities managers for significant cost savings.
Modular Cooling System
The HP Modular Cooling System [US/Engl.] is the solution for hot spots in the data center, providing close-coupled cooling for up to 35 kW of power in a single rack. HP MCS is a closed solution within the data center, that attaches to one or two racks, to ensure cooling to huge power densities while removing heat load from the data center. Designed for scale-out environments, MCS ensures that even the most power-dense deployments can scale and run seamlessly.
Power Distribution Rack
The HP Power Distribution Rack (PDR) [US/Engl.] improves power management in the data center by moving power distribution to the row level. Decentralizing power improves cable management, decreases diagnostic time for problems, and saves installation costs by reducing the size and number of long power feeds required to reach from large wall mounted distribution units. Housed in a single HP 10000 G2 42U rack, the PDR also saves floor space and allows you to move heat robbing transformers off of the data center floor improving cooling.
These and other infrastructure solutions work together with the embedded technology in HP servers and storage, increasing available data center capacity, and maximizing the efficiency of HP platforms.