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HP Symposium on Technology Trends in Computational Engineering
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Join us at the 11th HP CAE Symposium Series in APJ


Success of a product in the marketplace is driven by many factors concerning the product and market environment. Primary importance is vested with Design to achieve performance objectives for the least cost. In terms of Fit, Form and Functional Design requirements, it is imperative that the product performs admirably in the field. CAE solutions have attained the level of usability and reliability to achieve this in a timely manner.

HP would like to invite you to the 11th HP Asia-Pacific CAE Seminar Series. This event is the premier CAE event for customers in multiple industries including aerospace, automotive, semiconductor, consumer electronics, defense and security.

This popular one-day seminar will include over 20 of the industry's leading CAE applications experts, industry speakers, and more than 200 engineers and managers to discuss the latest innovations in CAE.

Keynote Presentations Include:

  • Dr. J.S. Hurley, Sr. Manager Distributed Computing, Networked Systems Technology, The Boeing Company.
  • Knute Christensen, Worldwide HPC Solutions Marketing Manager, Hewlett-Packard
  • Guodong Zhang, HPC Product and Technology Marketing, HPC Division, Hewlett-Packard
  • George Chaltas, Senior Engineering Manager, Intel Corporation

Register today!

July 14, 2008
Shanghai, China
Shanghai Jin Jiang Tower Hotel

July 16, 2008
Seoul, Korea
COEX Intercontinental Hotel
www.hp.co.kr/event/cae2008

July 18, 2008
Tokyo, Japan
DAI-ICHI HOTEL TOKYO
http://h50146.www5.hp.com/events/seminars/info/0807/0718cae.html

July 22, 2008
Bangalore, India
The Leela Palace Kempinski Bangalore
http://www.endtoend.in/apps/forms/hp/cae/registration.html


Learn More about Scaling your CAE Applications!


This webcast on demand is a discussion of the latest developments in hardware and software that are enabling CAE solutions. Featured presenters include:

Thomas Parenteau, Total Petrochemicals USA
Donald H. Brown, CPD Associates
Ed Turkel, Hewlett Packard

Learn about the state-of-the industry, the technologies behind recent advances, and what we can expect to see over the next few years in CAE.


»  Scientific Computing

19th Annual HP CAE Symposium

The 19th Annual HP CAE Symposium was held on Tuesday, April 8th, 2008 at The Long Beach Marriott, Long Beach CA. This event is HP’s premier and largest annual North American CAE event. Check out the Symposium website for presentations delivered at the event:


www.hp.com/go/caesymposium

This homepage for CAE offers visitors specific information about HP Solutions for CAE, the software companies we partner with,
System Tuning advice to maximize performance, and exciting marketing events we are involved in.

To conveniently return to this CAE page in the future, use www.hp.com/go/cae.

The trends in Computer-Aided Engineering (CAE) toward increasingly powerful, less expensive hardware and more sophisticated, easier-to-use software combine to make engineering analysis feasible today. This has enabled analytical engineering and process manufacturing organizations to vastly improve productivity, bringing products to market faster and cheaper. For example, complex optimization studies, using computational fluid and solid mechanics techniques, enables product design integrity to be improved before costly investments are made in downstream operations.

However, rapidly changing hardware and software architectures makes it difficult to determine what hardware provides the best application performance. HP has teamed with leading independent software vendors to offer the best technical computing solutions for your CAE needs. Consult with HP about your specific applications and receive information to identify the optimal technical platforms, O/S configurations, and other information necessary to help you get the best performance from your investments.


Why HP?

  • Performance leadership
  • Technical partnership with ISVs
  • HP Teamwork for customer success
  • Renowned system reliability
  • Breadth of product offering and roadmap

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